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Dicing
Silicon Wafers
PCB/FR4 Boards
Optical Glass Plates
We are able to process materials and substrates for many different applications. The dicing process is systematically tuned for each application to produce the highest quality results. Top side protection is available and recommended for most products.
Inspection
Quality Assurance
Meet Specification
Photos Available
After singulating, die are inspected to ensure the highest cut quality is met and the die meets specification. We take pride in our work and will be sure to meet or exceed your expectations. Part cleaning and packing services can be provided.
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