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Dicing Services
We are able to process materials and substrates for many different applications. The dicing process is systematically tuned for each application to produce the highest quality results. Top side protection is available and recommended for most products.
Silicon Wafers
PCB/FR4
Dicing Plus can process your PCB parts quickly and effectively. We use blades designed specifically for cutting FR4 printed circuit boards. We also cut Rodgers Materials, laminates, and ceramics.
Optical Glass Plates
Thick photomask plates can be processed quickly, with excellent cut quality. We are able to dice all types of glass including soda lime, borosilicate, white crown, and quartz.
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